Usually, the following base materials are on stock:
FR1, FR2, FR4, CEM1, CEM3, photo-resist materials.
Board thickness 0.8 to 2 mm.(single and double sided)
Copper thickness 35µ, 18µ.
Overall board thickness tolerance + 0.05 mm
Max. Panels size 450x600 mm
Holes:
Min. Tool size 0.5mm.
Max Tool size 6.0 mm
Routed slots slots width 1.0 m
Size and location of hole tolerance < 0.00023 inch
Dry film:
Min. Track 0.1mm
Screen printing:
Solder mask : green, red and blue
Legend : white & black.
Legend. Line width : 8 mils (0.2 mm).
Carbon ink & peelable mask : on demand.
Surface finish:
Pre flux & O.S.P (mec-seal) &Tinning
Hydraulic punching tools
Normal capacity : 200 ton
Working area : 460 x 680 (mm)
Mechanical finish
Routing & V- Scoring.
Electrical test with bare boards tester (B.B.T)
Test capacity : 2048 points\board
Plating line
Over Plating With 25 Microns. Of Electrolytic Copper
- Complete integrity of hole-wall and inner layer adhesion ( is maintained often multiple solder float tests 288oc ,10 second )
- No increase in electrical resistance occurs when inner layer connections are tested according to BS 9762
- With stands severe thermal shock and thermal cycling tests
[5 cycles of fluidised0 sand bath of 250oc followed by 25o water quench]
Packing
Efficient vacuum packing system